Frequently Asked Questions (FAQ)

As your dedicated PCB technical partner, we’ve compiled these professional FAQs to help you optimize your designs and ensure manufacturing success.

DFM & Design Guidance (设计与工艺审核)

Q1: What are the most common DFM issues found during Gerber review? (常见设计错误) +

EN: The most common issues include insufficient annular rings on vias, trace-to-edge clearance violations, and silkscreen overlapping pads. We perform a full DFM check before production to identify these risks and suggest corrections.

CN: 常见问题包括过孔焊环不足、线路到板边距离不够以及丝印压焊盘。我们在生产前会进行全套 DFM 审核，发现并反馈这些风险。

Contact: sales@yostarpcb.com | emily@yudapcb.com

Q2: Any tips for High-speed Differential Pairs? (高速差分线建议) +

EN: Maintain symmetrical routing and consistent spacing. Avoid placing vias on differential pairs where possible. We can help calculate the exact trace geometry to meet your impedance targets.

CN: 保持走线对称和间距一致，尽量避免在差分线上打孔。我们可以协助计算精确的走线尺寸以达到阻抗目标。

Contact: sales@yostarpcb.com | emily@yudapcb.com

1. Multilayer PCB (多层板)

Q3: What data is needed for a Multilayer PCB quote? (多层板报价资料) +

EN: Please provide Gerber files, stack-up requirements, board thickness, copper weight, and surface finish (ENIG, HASL, etc.).

CN: 请提供 Gerber 文件、叠层要求、板厚、铜厚以及表面处理要求（沉金、喷锡等）。

Contact: sales@yostarpcb.com | emily@yudapcb.com

2. HDI PCB (高密度互连板)

Q4: What HDI structures do you support? (支持的 HDI 结构) +

EN: We support 1+N+1, 2+N+2, and 3+N+3 structures with laser microvias and via-in-pad technology.

CN: 我们支持 1+N+1, 2+N+2 以及 3+N+3 叠层结构，包含激光微孔和盘中孔技术。

Contact: sales@yostarpcb.com | emily@yudapcb.com

3. High-Frequency PCB (高频板)

Q5: Which materials are used for HF boards? (高频板材选择) +

EN: We commonly use Rogers, PTFE, and Taconic materials. Hybrid FR4+Rogers stack-ups are also available to optimize cost.

CN: 我们常使用 Rogers, PTFE 和 Taconic 板材，也提供 FR4+Rogers 混压结构以优化成本。

Contact: sales@yostarpcb.com | emily@yudapcb.com

4. Rigid-Flex PCB (刚挠结合板)

Q6: How to define bending areas? (如何定义弯折区) +

EN: Clearly mark flex/rigid zones in your Gerber layers. Avoid placing components or vias in the dynamic bending areas.

CN: 在 Gerber 层中清晰标注软区和硬区，避免在动态弯折区放置元器件或过孔。

Contact: sales@yostarpcb.com | emily@yudapcb.com

5. Blind & Buried Via PCB (盲埋孔板)

Q7: When to use blind/buried vias? (为何使用盲埋孔) +

EN: Use them to increase routing density in complex multilayer designs where surface space is limited.

CN: 用于在表面空间有限的复杂多层设计中增加布线密度。

Contact: sales@yostarpcb.com | emily@yudapcb.com

6. Impedance-Controlled PCB (阻抗板)

Q8: What is your impedance tolerance? (阻抗公差是多少) +

EN: Standard tolerance is ±10%, but we can achieve ±8% or tighter upon special request and engineering review.

CN: 标准公差为 ±10%，经过工程评估后，我们可以实现 ±8% 或更严的公差。

Contact: sales@yostarpcb.com | emily@yudapcb.com

7. Hybrid Lamination PCB (混压板)

Q9: Why choose hybrid lamination? (为何选择混压) +

EN: It combines high-performance materials (like RF laminates) with standard FR4 to save costs while maintaining signal integrity.

CN: 它将高性能材料（如射频板材）与标准 FR4 结合，在保持信号完整性的同时节省成本。

Contact: sales@yostarpcb.com | emily@yudapcb.com

If you have more technical questions, please reach out to us directly. We provide professional DFM feedback within 24 hours.