Product Categories
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Multilayer PCB
Standard multilayer boards from 4 to 40 layers. Reliable performance for industrial and telecom applications.
HDI PCB
High Density Interconnect with microvias. Support up to 3rd-order HDI (3+N+3).
High-Frequency PCB
Using Rogers, PTFE materials for RF and high-speed signal applications.
Rigid-Flex PCB
Combination of rigid and flexible boards for compact and reliable device design.
Blind & Buried Via PCB
Advanced via structures for high-density interconnections.
Impedance PCB
Tight tolerance control for high-speed digital and RF signal integrity.
Hybrid Lamination PCB
Special lamination combining different materials (FR4 + Rogers/Aluminum).